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IPC SMC-TR-001

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IPC SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology

standard by Association Connecting Electronics Industries, 01/01/1989

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Full Description

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

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2021-02-27
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