Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.
Product Details
Published: 04/01/1992 Number of Pages: 15
M00001610
2021-02-27
New product
IPC J-STD-003
Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/1992