Covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as part of the printed wiring board. It defines dielectric thermally conductive adhesives through a specification of test methods and inspection criteria.
Product Details
Published: 01/01/1995 Number of Pages: 18 File Size: 1 file , 140 KB Product Code(s): CA-821(D)1
M00001589
2021-02-27
New product
IPC CA-821
General Requirements for Thermally Conductive Adhesives
standard by Association Connecting Electronics Industries, 01/01/1995