The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level should be used for initial reliability qualification.
Product Details
Published: 04/01/1999 Number of Pages: 19 File Size: 1 file , 170 KB Part of: IPC 9500-K, IPC M109 Product Code(s): 9503(D)1