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IPC J-STD-026
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IPC J-STD-026 Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
Full Description
This new standard addresses semiconductor flip chip design requirements. Provides information intended for applications utilizing standard semiconductor substrates, materials, assembly and test methods commensurate with established fabrication, bumping, test and handling practices. Covered in the standard are electrical, thermal and mechanical chip design parameters and methodologies, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs
M00001536
2021-02-27
New product
IPC J-STD-026 Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999