The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induced stress. They can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard is used to determine what classification level should be used for initial reliability qualification.
Product Details
Published: 04/01/1999 Number of Pages: 20 Part of: IPC M109
M00001533
2021-02-27
New product
IPC J-STD-020A
Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
standard by Association Connecting Electronics Industries, 04/01/1999