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IPC 4104
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IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
Full Description
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.
M00001531
2021-02-27
New product
IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999