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IPC J-STD-027
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IPC J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
Full Description
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
M00001473
2021-02-27
New product
IPC J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003