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IPC 4563
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IPC 4563 Resin Coated Copper Foil for Printed Boards Guideline
standard by Association Connecting Electronics Industries, 11/01/2007
Full Description
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
M00001408
2021-02-27
New product
IPC 4563 Resin Coated Copper Foil for Printed Boards Guideline
standard by Association Connecting Electronics Industries, 11/01/2007