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IPC J-STD-002C
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IPC J-STD-002C Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)
standard by Association Connecting Electronics Industries, 12/01/2007
Full Description
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users.
M00001406
2021-02-27
New product
IPC J-STD-002C Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)
standard by Association Connecting Electronics Industries, 12/01/2007