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IPC T-50H Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
Full Description
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision H contains over 200 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, conductor patterns, assembly processes, base materials and selective plating processes. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.
M00001398
2021-02-27
New product
IPC T-50H Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008