This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:
1) those assemblies that are assembled with lead-containing or lead-free solder; 2) components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3) the maximum component temperature not to be exceeded during assembly or rework processing; 4) the base materials used in the PCB construction, including those PCBs that use halogen-free resin; 5) the surface finish of PCBs; and 6) the conformal coating on PCBAs.
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Published: 03/01/2010 Number of Pages: 13 File Size: 1 file , 550 KB