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IPC 7525B
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IPC 7525B Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 10/01/2011
Full Description
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
M00001356
2021-02-27
New product
IPC 7525B Stencil Design Guidelines
standard by Association Connecting Electronics Industries, 10/01/2011