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IPC J-STD-005A

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IPC J-STD-005A Requirements for Soldering Pastes

standard by Association Connecting Electronics Industries, 02/01/2012

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Full Description

This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

Product Details

Published: 02/01/2012 ANSI: ANSI Approved Number of Pages: 24 File Size: 1 file , 1.1 MB

M00001351
2021-02-27
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