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IPC J-STD-033C
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IPC J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 02/01/2012
Full Description
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented.
M00001349
2021-02-27
New product
IPC J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
standard by Association Connecting Electronics Industries, 02/01/2012