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IPC 7621
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IPC 7621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018
Full Description
Encapsulation, for the purpose of IPC 7621, is defined as a low pressure molded thermoplastic, e.g., polyamide, whichis brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point,forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of LPM encapsulation depend onthe application and must be considered when selecting material. Users are urged to consult material suppliers for detailedtechnical data. This guide will aid the user in understanding the capabilities and limits of LPM using thermoplastics.
M00001232
2021-02-27
New product
IPC 7621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
standard by Association Connecting Electronics Industries, 01/01/2018