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IPC 9301
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IPC 9301 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018
Full Description
The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
M00001213
2021-02-27
New product
IPC 9301 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
standard by Association Connecting Electronics Industries, 12/01/2018