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IEC 60749-42 Ed. 1.0 b:2014
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IEC 60749-42 Ed. 1.0 b:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
standard by International Electrotechnical Commission, 08/12/2014
Full Description
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
M00007803
2021-02-22
New product
IEC 60749-42 Ed. 1.0 b:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
standard by International Electrotechnical Commission, 08/12/2014