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IEC 61189-3 Ed. 1.0 b:1997
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IEC 61189-3 Ed. 1.0 b:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
standard by International Electrotechnical Commission, 04/10/1997
Full Description
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.
M00007530
2021-02-22
New product
IEC 61189-3 Ed. 1.0 b:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
standard by International Electrotechnical Commission, 04/10/1997