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IEC 60191-5 Ed. 2.0 b:1997
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IEC 60191-5 Ed. 2.0 b:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
standard by International Electrotechnical Commission, 04/23/1997
Full Description
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
M00007522
2021-02-22
New product
IEC 60191-5 Ed. 2.0 b:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
standard by International Electrotechnical Commission, 04/23/1997