- -55%
- New
IEC 60749-15 Ed. 3.0 b:2020
$47.00
$21.15
Save 55%
IEC 60749-15 Ed. 3.0 b:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
standard by International Electrotechnical Commission, 07/14/2020
Full Description
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
M00007261
2021-02-22
New product
IEC 60749-15 Ed. 3.0 b:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
standard by International Electrotechnical Commission, 07/14/2020