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IEC 62047-16 Ed. 1.0 b:2015
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IEC 62047-16 Ed. 1.0 b:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
standard by International Electrotechnical Commission, 03/05/2015
Full Description
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 to 10 in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
M00007079
2021-02-22
New product
IEC 62047-16 Ed. 1.0 b:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
standard by International Electrotechnical Commission, 03/05/2015