GMW18293

Description / Abstract: GMW18293, 1st Edition, July 2020 - Thermal Interface Materials

Note: Nothing in this standard supercedes applicable laws and regulations.

Note: In the event of conflict between the English and domestic language, the English language shall take precedence.

Purpose/Material Description.

This specification details the requirements of Thermal Interface Materials (TIMs) that are suitable for use as thermally conductive adhesives, gap fillers, pads, greases, and thermal tapes for use in Rechargeable Energy Storage System (RESS) applications.

Symbols.

Not applicable.

Applicability.

RESS components requiring thermally conductive attachments or interfaces, such as a Cell Module Assembly (CMA) interface to the cooling plate.

Remarks.

TIMs are described a family of thermally conductive materials designed to manage varying or uneven surfaces by adding component stability, vibration control, and electrical insulation to the device. Many gap fillers also add structural strength to components and provide both thermal conductivity and high bond strength.

Classification by Application Type.

Type 1:

Gap Filler. Liquid dispensed gap filler which may be desirable when removal/serviceability is required.

Type 2:

Thermal Adhesive and Gap Filler. Liquid dispensed gap filler with semi-structural adhesive characteristics.

Type 3:

Thermal Pad. Typically consist of a highly conformable, slightly tacky sheet filled with conductive particles. Available in sheets, die cut shapes, and custom thicknesses.

Type 4:

Thermal Grease. Generally used in applications were the heat sink may need to be removed (serviceable), such as electronic components. Typically, single component, low-viscosity, non-reactive silicone or polymer.

Type 5:

Thermally Conductive Tape. Used to provide a preferential heat-transfer path between heat generating devices and cooling devices, typically using a pressure sensitive adhesive.

Classification by Curing Method.

Curing Method A:

Not applicable.

Curing Method B:

Room Temperature Cure.

Curing Method C:

Elevated Temperature Cure.

Curing Method D:

Ultraviolet Cure.

Curing Method E:

Other. Identified within the material note on the part print.

Classification by Polymer Matrix.

The polymer comprising the matrix shall be classified and coded according to the descriptions shown in Table 1, where X = 1 or 2, based on the number of polymer components. Example: 2E is two-part epoxy.

Classification by Performance.

Thermal Conductivity per ASTM D5470. Report as X.X for material coding.