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BS PD IEC TR 61189-5-506:2019
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BS PD IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder flu
standard by BSI Group, 07/18/2019
Full Description
This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-m gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 m and 500 m.Cross References:
IEC 60068-2-20:2008
IEC 61189-5-501
All current amendments available at time of purchase are included with the purchase of this document.
M00011721
2021-02-16
New product
BS PD IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder flu
standard by BSI Group, 07/18/2019